Cooling system

ABSTRACT

Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of thermally coupling to heat generating components and adapted to transfer heat from the heat generating components is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of applicationSer. No. 10/715,322 filed on Nov. 14, 2003 entitled “Liquid CoolingSystem”. The priority date of such application is claimed for thepresent application. The present application is also acontinuation-in-part of application Ser. No. 10/666,189, filed Sep. 10,2003, entitled “Liquid Cooling System,” and which is herein incorporatedby reference and application Ser. No. 10/688,587, filed Oct. 18, 2003,entitled “Liquid Cooling System,” and which is herein incorporated byreference.

Processors are at the heart of most computing systems. Whether acomputing system is a desktop computer, a laptop computer, acommunication system, a television, etc., processors are often thefundamental building block of the system. These processors may bedeployed as central processing units, as memories, controllers, etc.

As computing systems advance, the power of the processors driving thesecomputing systems increases. The speed and power of the processors areachieved by using new combinations of materials, such as silicon,germanium, etc., and by populating the processor with a larger number ofcircuits. The increased circuitry per area of processor as well as theconductive properties of the materials used to build the processorsresult in the generation of heat. Further, as these computing systemsbecome more sophisticated, several processors are implemented within thecomputing system and generate heat. In addition to the processors, othersystems operating within the computing system may also generate heat andadd to the heat experienced by the processors.

A range of adverse effects result from the increased heat. At one end ofthe spectrum, the processor begins to malfunction from the heat andincorrectly processes information. This may be referred to as computingbreakdown. For example, when the circuits on a processor are implementedwith digital logic devices, the digital logic devices may incorrectlyregister a logical zero or a logical one. For example, logical zeros maybe mistaken as logical ones or vice versa. On the other hand, when theprocessors become too heated, the processors may experience a physicalbreakdown in their structure. For example, the metallic leads or wiresconnected to the core of a processor may begin to melt and/or thestructure of the semiconductor material (i.e., silicon, germanium, etc.)itself may breakdown once certain heat thresholds are met. These typesof physical breakdowns may be irreversible and render the processor andcomputer system inoperable and unrepairable.

A number of approaches have been implemented to address processorheating. Initial approaches focused on air-cooling. These techniques maybe separated into 3 categories: 1) cooling techniques which focused oncooling the air outside of the computing system; 2) cooling techniquesthat focused on cooling the air inside the computing system; and 3) acombination of the cooling techniques (i.e., 1 and 2).

Many of these conventional approaches are elaborate and costly. Forexample, one approach for cooling air outside of the computing systeminvolves the use of a cold room. A cold room is typically implemented ina specially constructed data center, which includes air conditioningunits, specialized flooring, walls, etc., to generate and retain as muchcooled air within the cold room as possible.

Cold rooms are very costly to build and operate. The specializedbuildings, walls, flooring, air conditioning systems, and the power torun the air conditioning systems all add to the cost of building andoperating the cold room. In addition, an elaborate ventilation system istypically also implemented and in some cases additional cooling systemsmay be installed in floors and ceilings to circulate a high volume ofair through the cold room. Further, in these cold rooms, computingequipment is typically installed in specialized racks to facilitate theflow of cooled air around and through the computing system. However,with decreasing profit margins in many industries, operators are notwilling to incur the expenses associated with operating a cold room. Inaddition, as computing systems are implemented in small companies and inhomes, end users are unable and unwilling to incur the cost associatedwith the cold room, which makes the cold room impractical for this typeof user.

The second type of conventional cooling technique focused on cooling theair surrounding the processor. This approach focused on cooling the airwithin the computing system. Examples of this approach includeimplementing simple ventilation holes or slots in the chassis of acomputing system, deploying a fan within the chassis of the computingsystem, etc. However, as processors become more densely populated withcircuitry and as the number of processors implemented in a computingsystem increases, cooling the air within the computing system can nolonger dissipate the necessary amount of heat from the processor or thechassis of a computing system.

Conventional techniques also involve a combination of cooling the airoutside of the computing system and cooling the air inside the computingsystem. However, as with the previous techniques, this approach is alsolimited. The heat produced by processors has quickly exceeded beyond thelevels that can be cooled using a combination of the air-coolingtechniques mentioned above.

Other conventional methods of cooling computing systems include theaddition of heat sinks. Very sophisticated heat sink designs have beenimplemented to create heat sinks that can remove the heat from aprocessor. Further, advanced manufacturing techniques have beendeveloped to produce heat sinks that are capable of removing the vastamount of heat that can be generated by a processor. However, in mostheat sinks, the size of the heat sink is directly proportional to theamount of heat that can be dissipated by the heat sink. Therefore, themore heat to be dissipated by the heat sink, the larger the heat sink.Certainly, larger heat sinks can always be manufactured; however, thesize of the heat sink can become so large that heat sinks becomeinfeasible.

Refrigeration techniques and heat pipes have also been used to dissipateheat from a processor. However, each of these techniques haslimitations. Refrigeration techniques require substantial additionalpower, which drains the battery in a computing system. In addition,condensation and moisture, which is damaging to the electronics incomputing systems, typically develops when using the refrigerationtechniques. Heat pipes provide yet another alternative; however,conventional heat pipes have proven to be ineffective in dissipating thelarge amount of heat generated by a processor.

In yet another approach for managing the heat issues associated with aprocessor, designers have developed methods for controlling theoperating speed of a processor to manage the heat generated by theprocessor. In this approach, the processing speed is throttled based onthe heat produced by the processor. For example, as the processor heatsto dangerous limits (i.e., computing breakdown or structural breakdown),the processing speed is stepped down to a lower speed.

At the lower speed, the processor is able to operate withoutexperiencing computing breakdown or structural breakdown. However, thisoften results in a processor operating at a level below the level thatthe processor was marketed to the public or rated. This also results inslower overall performance of the computing system. For example, manyconventional chips incorporate a speed step methodology. Using the speedstep method, a processor reduces its speed by a percentage once theprocessor reaches a specific thermal threshold. If the processorcontinues to heat up to the second thermal threshold, the processor willreduce its speed by an additional 25 percent of its rated speed. If theheat continues to rise, the speed step methodology will continue toreduce the speed to a point where the processor will stop processingdata and the computer will cease to function.

As a result of implementing the speed step technology, a processormarketed as a one-gigahertz processor may operate at 250 megahertz orless. Therefore, although this may protect a processor from structuralbreakdown or computing breakdown, it reduces the operating performanceof the processor and the ultimate performance of the computing system.While this may be a feasible solution, it is certainly not an optimalsolution because processor performance is reduced using this technique.Therefore, thermal (i.e., heat) issues negate the tremendous amount ofresearch and development expended to advance processor performance.

In addition to the thermal issues, a heat dissipation method and/orapparatus must be deployed in the chassis of a computing system, whichhas limited space. Further, as a result of the competitive nature of theelectronics industry, the additional cost for any heat dissipationmethod or apparatus must be very low or incremental.

Thus, there is a need in the art for a method and apparatus for coolingcomputing systems. There is a need in the art for a method and apparatusfor cooling processors deployed within a computing system. There is aneed in the art for an optimal, cost-effective method and apparatus forcooling processors, which also allows the processor to operate at themarketed operating capacity. There is a need for a method or apparatusused to dissipate processor heat which can be deployed within the smallfootprint available in the case or housing of a computing system, suchas a laptop computer, standalone computer, cellular telephone, etc.

SUMMARY OF THE INVENTION

A method and apparatus for dissipating heat from processors arepresented. A variety of heat transfer systems are implemented. Liquid isused in combination with the heat transfer system to dissipate heat froma processor. Each heat transfer system is combined with a heat exchangesystem. Each heat exchange system receives heated liquid and producescooled liquid.

During operation, each heat transfer system may be mated with aprocessor, which produces heat. Liquid is processed through the heattransfer system to dissipate the heat. As the liquid is processedthrough the heat transfer system the liquid becomes heated liquid. Theheated liquid is transported to the heat exchange system. The heatexchange system receives the heated liquid and produces cooled liquid.The cooled liquid is then transported back to the heat transfer systemto dissipate the heat produced by the processor.

A liquid cooling system comprising a first electron conducting materialincluding a first hot region and a first cold region capable of matingwith a processor generating heat; a second electron conducting materialincluding a second hot region and a second cold region coupled to thefirst cold region, the second cold region capable of mating with theprocessor generating heat; an inlet receiving cooled liquid; a firstconduit coupled to the inlet and coupled to the first hot region, thefirst conduit conveying the cooled liquid and dissipating heat from thefirst hot region in response to the cooled liquid; a second conduitcoupled to the inlet and coupled to the second hot region, the secondconduit conveying the cooled liquid and dissipating heat from the secondhot region in response to the cooled liquid; and an outlet coupled tothe first conduit and coupled to the second conduit, the outletoutputting heated liquid in response to the cooled liquid conveyed onthe first conduit and in response to the cooled liquid conveyed on thesecond conduit liquid.

A liquid cooling system comprising a heat transfer unit operating underthe peltier effect, the heat transfer unit including a cold region and ahot region generating heat, wherein the cold regions is capable ofmating with a processor; a conduit coupled to the hot region anddissipating heat by transporting cooled liquid, the cooled liquidtransforming into heated liquid in response to the heat from the hotregion; and a heat exchange unit coupled to the conduit and receivingthe heated liquid, the heat exchange unit generating the cooled liquidin response to receiving the heated liquid.

A liquid cooling system comprising a first heat transfer unit operatingunder the peltier effect, the heat transfer unit including a first coldregion and a first hot region generating heat, wherein the cold regionis capable of mating with a processor on a first interface anddissipating heat from the first side; and a second heat transfer unitoperating under the peltier effect, the second heat transfer unitincluding a second cold region and a second hot region generating heat,wherein the second cold region is capable of mating with a processor ona second side and dissipating heat from the second side.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 displays a system view of a liquid cooling system disposed in ahousing and implemented in accordance with the teachings of the presentinvention.

FIG. 2 displays a sectional view of a heat exchange system implementedin accordance with the teachings of the present invention.

FIG. 3 displays a system view of a liquid cooling system disposed in ahousing and implemented in accordance with the teachings of the presentinvention.

FIG. 4A displays a system view of a liquid cooling system suitable foruse in a mobile computing environment, such as a laptop, and implementedin accordance with the teachings of the present invention.

FIG. 4B displays a cross-sectional view of the heat exchange systemdepicted in FIG. 4A.

FIG. 5 displays a system view of another liquid cooling system suitablefor use in a mobile computing environment, such as a Personal DigitalAssistant (PDA), and implemented in accordance with the teachings of thepresent invention.

FIG. 6 displays a top view of an embodiment of a heat transfer systemsuch as a Solid-state system, and implemented in accordance with theteachings of the present invention.

FIG. 7A displays a bottom view of an embodiment of a heat transfersystem, such as a solid-state system implemented in accordance with theteachings of the present invention.

FIG. 7B displays one embodiment of a sectional view of an embodiment ofa heat transfer system, such as a solid-state heat transfer systemdepicted in FIG. 7A.

FIG. 8 displays another embodiment of a sectional view of an embodimentof a heat transfer system, such as a solid-state heat transfer systemdepicted in FIG. 7A.

FIG. 9 displays one embodiment of a sectional view of a multi-layeredheat transfer system, such as a multi-layered, solid-state heat transfersystem.

DETAILED DESCRIPTION

While the present invention is described herein with reference toillustrative embodiments for particular applications, it should beunderstood that the invention is not limited thereto. Those havingordinary skill in the art and access to the teachings provided hereinwill recognize additional modifications, applications, and embodimentswithin the scope thereof and additional fields in which the presentinvention would be of significant utility.

A variety of liquid cooling systems are presented. In each embodiment ofthe present invention, a heat transfer system in combination with a heatexchange system is used to dissipate heat from a processor. The variousheat transfer systems may be intermixed with the heat exchange systemsto create a variety of liquid cooling systems.

Several heat transfer systems are presented. Each heat transfer systemmay be used with a variety of heat exchange systems. For example, a heattransfer system is presented; a direct-exposure heat transfer system ispresented; a dual-surface heat transfer system is presented; adual-surface, direct-exposure heat transfer system is presented; amulti-processor, heat transfer system is presented; a multi-processor,dual-surface direct exposure heat transfer system is presented; amulti-surface heat transfer system is presented; a multi-surface,direct-emersion heat transfer system is presented; a circuit-board heattransfer system is presented. In addition, it should be appreciated thatcombinations and variations of the foregoing heat transfer systems maybe implemented and are within the scope of the present invention.

In addition to the heat transfer systems, heat exchange systems arepresented. For example, a first heat exchange system is depicted inFIGS. 1 and 2; a second heat exchange system is depicted in FIG. 3; afourth heat exchange system is depicted in FIG. 4; a fifth heat exchangesystem as depicted in FIG. 5. It should be appreciated that each of theforegoing heat exchange systems may be implemented with anyone of theforegoing heat transfer systems presented above.

In one embodiment of the present invention, a two-piece liquid coolingsystem is presented. The two-piece liquid cooling system includes: (1) aheat transfer system, which is capable of attachment to a processor, and(2) a heat exchange system. In one embodiment, a single conduit is usedto couple the heat transfer system to the heat exchange system. In asecond embodiment, a conduit transporting heated liquid and a conduittransporting cooled liquid are used to couple the heat transfer systemto the heat exchange system. It should also be appreciated that thetwo-piece liquid cooling system may also be deployed as a one-pieceliquid cooling system by deploying the heat transfer system and the heatexchange system in a single unit (i.e., a single consolidatedembodiment).

The two-piece liquid cooling system utilizes several mechanisms todissipate heat from a processor. In one embodiment, liquid is circulatedin the two-piece liquid cooling system to dissipate heat from theprocessor. The liquid is circulated in two ways. In one embodiment,power is applied to the two-piece liquid cooling system and the liquidis pumped through the two-piece liquid cooling system to dissipate heatfrom the processor. For the purposes of this discussion, this isreferred to as forced liquid circulation.

In a second embodiment, liquid input points and exit points arespecifically chosen in the heat transfer system and the heat exchangesystem to take advantage of the heating and cooling of the liquid andthe momentum resulting from the heating and cooling of the liquid. Forthe purposes of discussion, this is referred to as convective liquidcirculation.

In another embodiment, aircooling is used in conjunction with the liquidcooling to dissipate heat from the processor. In one embodiment, theair-cooling is performed by strategically placing fans in the housing ofthe computing system. In a second embodiment, the air-cooling isperformed by strategically placing a fan relative to the heat exchangesystem to increase the cooling performance of the heat exchange system.In yet another embodiment, heated air is expelled from the system duringcooling to provide for a significant dissipation of heat.

FIG. 1 displays a system view of a liquid cooling system disposed in ahousing and implemented in accordance with the teachings of the presentinvention. A housing or case 100 is shown. In one embodiment, thehousing or case 100 may be a computer case, such as a standalonecomputer case, a laptop computer case, etc. In another embodiment, thehousing or case 100 may include the case for a communication device,such as a cellular telephone case, etc. It should be appreciated thatthe housing or case 100 will include any case or containment unit, whichhouses a processor.

The housing or case 100 includes a motherboard 102. The motherboard 102includes any board that contains a processor 104. A motherboard 102implemented in accordance with the teachings of the present inventionmay vary in size and include additional electronics and processors. Inone embodiment, the motherboard 102 may be implemented with a printedcircuit board (PCB).

A processor 104 is disposed in the motherboard 102. The processor 104may include any type of processor 104 deployed in a modem computingsystem. For example, the processor 104 may be an integrated circuit, amemory, a microprocessor, an optoelectronic processor, an applicationspecific integrated circuit (ASIC), a field programmable gate array(FPGA), an optical device, etc., or a combination of foregoingprocessors.

In one embodiment, the processor 104 is connected to the heat transfersystem 106 using a variety of connection techniques. For example,attachment devices, such as clips, pins, etc., are used to attach theheat transfer system 106 to the processor 104. In addition, mechanismsfor providing for a quality contact (i.e., good heat transfer), such asepoxies, etc., may be disposed between the heat transfer system 106 andthe processor 104 and are within the scope of the present invention.

The heat transfer system 106 includes a cavity (not shown in FIG. 1)through which liquid flows in a direction denoted by liquid directionarrow 122. In one embodiment, the heat transfer system 106 ismanufactured from a material, such as copper, which facilitates thetransfer of heat from the processor 104. In another embodiment, the heattransfer system 106 may be constructed with a variety of materials,which work in a coordinated manner to efficiently transfer heat awayfrom the processor 104. It should be appreciated that the heat transfersystem 106 and the processor 104 may vary in size. For example, in oneembodiment, the heat transfer system 106 may be larger than theprocessor 104. A variety of heat transfer systems suitable for use asheat transfer system 106 are presented throughout the instantapplication. Many of the heat transfer systems are shown with asectional view such as a view shown along sectional lines 138.

A conduit denoted by 108A/108B is connected to the heat transfer system106. In one embodiment, the conduit 108A/108B may be built into the bodyof the heat transfer system 106. In another embodiment, the conduit108A/108B may be connected and detachable from heat transfer system 106.In one embodiment, the conduit 108A/108B is a liquid pathway thatfacilitates the transfer of liquid from the heat transfer system 106.

A conduit 118A/118B is connected to the heat transfer system 106. In oneembodiment, the conduit 118A/118B may be built into the body of the heattransfer system 106. In another embodiment, the conduit 118A/1188 may beconnected and detachable from heat transfer system 106. In oneembodiment, the conduit 118A/118B is a liquid pathway that facilitatesthe transfer of liquid to the heat transfer system 106.

In one embodiment, the conduit 108A/108B and the conduit 118A/118B maybe combined into a single conduit coupling the heat transfer system 106to the heat exchange system 112, where the single conduit transportsboth the heated and cooled liquid. In another embodiment, the conduit108A/108B and the conduit 118A/118B may be combined into a singleconduit coupling the heat transfer system 106 to the heat exchangesystem 112, where the single conduit is segmented into two conduits, onefor transporting the heated liquid and one for transporting the cooledliquid. In addition, in one embodiment, an opening or liquid pathwaytransferring liquid directly between the heat transfer system 106 andthe heat exchange system 112 without traversing any intermediatecomponents (i.e., other than conduit connectors) may be considered aconduit, such as conduit 108A/108B and/or conduit 118A/118B. Both theconduit 108A/108B and the conduit 118A/118B may be made from a plasticmaterial, metallic material, or any other material that would providethe desired characteristics for a specific application.

In one embodiment, the conduit 108A/108B includes three components:conduit 108A, connection unit 110, and conduit 108B. Conduit 108A isconnected between the heat transfer system 106 and the connection unit110. Conduit 108B is connected between connection unit 110 and heatexchange system 112. However, it should be appreciated that in oneembodiment, a single uniform connection may be considered a conduit108A/108B. In a second embodiment, the combination of conduit 108A, 110,and 108B may combine to form a single conduit.

In one embodiment, the conduit 118A/118B may also include threecomponents: conduit 118B, connection unit 120, and conduit 118B. Conduit118A is connected between the heat transfer system 106 and theconnection unit 120. Conduit 118B is connected between connection unit120 and heat exchange system 112. However, it should be appreciated thatin one embodiment, a single uniform conduit may be considered a conduit118A/118B. In a second embodiment, the combination of conduit 118A,connection unit 120, and conduit 118B may be combined to form a singleconduit.

In one embodiment, a motor 114 is positioned relative to heat exchangesystem 112 to power the operation of the heat exchange system 112. A fan116 is positioned relative to the heat exchange system 112 to move airdenoted as 132 within the housing or case 100 and expel the air 132through and/or around the heat exchange system 112 to the outside of thehousing or case 100 as denoted by air 134. It should be appreciated thatthe fan 116 may be positioned in a variety of locations includingbetween the heat exchange system 112 and the housing or case 100. Inaddition, in one embodiment, air vents 130 may be disposed at variouslocations within the housing or case 100.

In one embodiment, liquid is circulated in the liquid cooling systemdepicted in FIG. 1 to dissipate heat from processor 104. In oneembodiment, the liquid (i.e., cooled liquid, heated liquid, etc.) is anon-corrosive, propylene glycol based coolant.

It should be appreciated that several two-piece liquid cooling systemsare presented in the instant application. For example, heat transfersystem 106 may be considered the first piece and heat exchange system112 may be considered the second piece of a two-piece liquid coolingsystem. In another embodiment, heat transfer system 106 in combinationwith conduit 108A and conduit 118A may be considered the first piece ofa two-piece liquid cooling system, and heat exchange system 112 incombination with conduit 108B and conduit 118B may be considered thesecond piece of a two-piece liquid cooling system. It should beappreciated that a number of elements of the liquid cooling system maybe combined to deploy the liquid cooling system as a two-piece liquidcooling system. For example, the motor 114 may be combined with the heatexchange system 112 to produce one piece of a two-piece liquid coolingsystem.

During operation, cooled liquid as depicted by direction arrows 128 istransported in the conduit 118A/118B to the heat transfer system 106.The cooled liquid 128 in the conduit 118A/118B moves through a cavity inthe heat transfer system 106 as shown by liquid direction arrow 122. Inone embodiment, the heat transfer system 106 transfers heat from theprocessor 104 to the liquid denoted by direction arrow 122. Heating theliquid in the heat transfer system 106 with the heat from the processor104 transforms the cooled liquid 128 to heated liquid. It should beappreciated that the terms cooled liquid and heated liquid are relativeterms as used in this application and represent a liquid that has beencooled and a liquid that has been heated, respectively. The heatedliquid is then transported on conduits 108A/108B as depicted bydirectional arrows 124. In one embodiment of the present invention, thecooled liquid 128 enters the heat transfer system 106 at a lower pointthan the exit point for the heated liquid depicted by directional arrows124. As a result, as the cooled liquid 128 is heated it becomes lighterand rises in the heat transfer system 106. This creates liquid movement,liquid momentum, and liquid circulation (i.e., convective liquidcirculation) in the liquid cooling system.

The heated liquid 124 is transported through conduit 108A/108B to theheat exchange system 112. The heated liquid depicted by directionalarrows 124 enters the heat exchange system 112 through conduit 108B. Theheated liquid 124 has liquid momentum as a result of being heated andrising in the heat transfer system 106. It should be appreciated thatthe circulation of the heated liquid 124 is also aided by the pumpassembly (not shown) associated with the heat exchange system 112. Theheated liquid 124 then flows through the heat exchange system 112 asdepicted by directional arrows 126. As the heated liquid 124 flowsthrough the heat exchange system 112, the heated liquid 124 is cooled.As the heated liquid 124 is cooled, the heated liquid 124 becomesheavier and falls to the bottom of the heat exchange system 112. Thecooler, heavier liquid falling to the bottom of the heat exchange system112 also creates liquid movement, liquid momentum, and liquidcirculation (i.e., convective liquid circulation) in the system. Thecooled liquid 128 then exits the heat exchange system 112 through theconduit 118B.

As a result, in one embodiment of the present invention, liquidcirculation is created by: (1) heating cooled liquid 128 in heattransfer system 106 and then (2) cooling heated liquid 124 in heatexchange system 112. In both scenarios, liquid is introduced at acertain position in the heat transfer system 106 and the heat exchangesystem 112 to create the momentum (i.e. convective liquid circulation)resulting from heating and cooling of the liquid. For example, in oneembodiment, cooled liquid 128 is introduced in the heat transfer system106 at a position that is below the position that the heated liquid 124exits the heat transfer system 106. Therefore, conduit 118A, whichtransports cooled liquid 128 to heat transfer system 106 is positionedbelow conduit 108A which transports the heated liquid 124 away from theheat transfer system 106. As a result, after the cooled liquid 128transported and introduced into the heat transfer system 106 by conduit118A is transformed to heated liquid 124, the lighter heated liquid 124rises in the heat transfer system 106 and exits through conduit 108Awhich is positioned above conduit 118A. In one embodiment, positioningconduit 108A above conduit 118A enables conduit 108A to receive andtransport the lighter-heated liquid 124, which rises in the heattransfer system 106.

A similar scenario occurs with the heat exchange system 112. The conduit108B, which transports the heated liquid 124, is positioned above theconduit 118B, which transports the cooled liquid 128. For example, inone embodiment, conduit 108B is positioned at the top portion of theheat exchange system 112. Therefore, heated liquid 124 is introducedinto the top of the heat exchange system 112. As the heated liquid 124cools in heat exchange system 112, the heated liquid 124 becomes heavierand falls to the bottom of the heat exchange system 112. A conduit 118Bis then positioned at the bottom of the heat exchange system 112 toreceive and transport the cooled liquid 128.

In addition to the convective liquid circulation occurring as a resultof the positioning of inlet and outlet points in the heat transfersystem 106 and the heat exchange system 112, a pump (not shown inFIG. 1) is also used to circulate liquid within the liquid coolingsystem. For the purposes of discussion, the liquid circulation resultingfrom the use of power (i.e., the pump) may be called forced circulation.Therefore, processor heat dissipation is accomplished using convectiveliquid circulation and forced circulation.

In addition to circulating liquid within the liquid cooling system, afan 116 is used to move air across, around, and through the heatexchange system 112. In one embodiment, the fan 116 is positioned tomove air through and around the heat exchange system 112 to createsubstantial additional liquid cooling with the heat exchange system 112.In another embodiment, air (i.e., depicted by 132) heated within thehousing or case 100 is expelled outside of the housing or case 100 asdepicted by 134 to provide additional heat dissipation.

In one embodiment, each of the methods, such as convective liquidcirculation, forced liquid circulation, delivering air through the heatexchange system 112, and expelling air from within the housing or case100, may each be used separately or in combination. As each technique iscombined or added in combination, an exponentially increasing amount ofheat dissipation is achieved.

FIG. 2 displays a sectional view of a heat exchange system implementedin accordance with the teachings of the present invention. FIG. 2displays a sectional view of heat exchange system 112 along section line140 shown in FIG. 1. A cross section of the motor 114 is shown. Themotor 114 is positioned above heat exchange system 112; however, themotor 114 may be positioned on the sides or on the bottom of heatexchange system 112. Further, heat exchange system 112 may be deployedwithout the motor 114 and derive power from another location in thesystem.

Heat exchange system 112 includes an input cavity 200, a heat dissipater210, and an output cavity 212. In one embodiment, the motor 114 isconnected through a shaft 202 to an impeller 216, disposed in animpeller case 214. In one embodiment, the input cavity 200 is connectedto the conduit 108B. In another embodiment, an impeller case 214, animpeller casing input 220, and an impeller exhaust 218 are positionedwithin the output cavity 212. The impeller exhaust 218 is connected tothe conduit 118B. Further, in one embodiment, liquid tubes 208 runthrough the length of the heat dissipater 210 and transport liquid fromthe input cavity 200 to the output cavity 212. In yet anotherembodiment, heat exchange system 112 may be fitted with a snap-in unitfor easy connection to housing or case 100 of FIG. 1.

In one embodiment, the input cavity 200, the heat dissipater 210, andthe output cavity 212 may be made from metal, metallic compounds,plastics, or any other materials that would optimize the system for aparticular application. In one embodiment, the input cavity 200 and theoutput cavity 212 are connected to the heat dissipater 210 using solder,adhesives, or a mechanical attachment. In another embodiment, the heatdissipater 210 is made from copper. In yet another embodiment, the heatdissipater 210 could be made from aluminum or other suitable thermallyconductive materials. For example, the fin units 204 may be made fromcopper, aluminum, or other suitable thermally conductive materials.

Although straight liquid tubes 208 are shown in FIG. 2, serpentine,bending, and flexible liquid tubes 208 are contemplated and within thescope of the present invention. In one embodiment, the liquid tubes 208may be made from metal, metallic compounds, plastics, or any othermaterials that would optimize the system for a particular application.The liquid tubes 208 are opened on both sides to receive heated liquidfrom the input cavity 200 and to output cooled liquid to the outputcavity 212. In one embodiment, the liquid tubes 208 are designed toencourage non-laminar flow of liquid in the tubes. As such, moreeffectively cooling of the liquid is accomplished.

In one embodiment, a shaft 202 runs through the input cavity 200,through the heat dissipater 210 (i.e., through a liquid tube 208), tothe output cavity 212. It should be appreciated that the shaft 202 maybe made from a variety of materials, such as metal, metallic compounds,plastics, or any other materials that would optimize the system for aparticular application.

The heat dissipater 210 includes a plurality of liquid tubes 208 and finunits 204 including fins 206. The liquid tubes 208, fin units 204, andfins 206 may each vary in number, size, and orientation. For example,the fins 206 maybe straight as displayed in FIG. 2, bent into an arch,etc. In addition, fins 206 may be implemented with a variety of angularbends, such as 45-degree angular bends. Further, the fins 206 arearranged to produce non-laminar flow of the air stream as the airdenoted as 132 of FIG. 1 transition through the fins 206 to the airdenoted by 134 of FIG. 1.

The motor 114 is positioned on one end of the shaft 202 and an impeller216 is positioned on an oppositely disposed end of the shaft 202. In oneembodiment, the motor 114 may be implemented with a brushless directcurrent motor; however, other types of motors, such as AC induction, AC,or DC servo-motors, may be used. Further, different types of motors thatare capable of operating a pump are contemplated and are within thescope of the present invention.

In one embodiment, the pump is implemented with an impeller 216.However, it should be appreciated that other types of pumps may bedeployed and are in the scope of the present invention. For example,inline pumps, positive displacement pumps, caterpillar pumps, andsubmerged pumps are contemplated and within the scope of the presentinvention. The impeller 216 is positioned within an impeller case 214.In one embodiment, the impeller 216 and the impeller case 214 arepositioned in an output cavity 212. However, it should be appreciatedthat in an alternate embodiment, the impeller 216 and the impeller case214 may be positioned outside of the output cavity 212 at another pointin the liquid cooling system. In a second embodiment, the pump isdeployed at the bottom of the output cavity 212 and as such isself-priming.

During operation, heated liquid is received in the input cavity 200 fromthe conduit 108B. The heated liquid is distributed across the liquidtubes 208 and flow through the liquid tubes 208. As the heated liquidflows through the liquid tubes 208, the heated liquid is cooled by thefin units 204 that transform the heated liquid into cooled liquid. Thecooled liquid is then deposited in the output cavity 212 from the liquidtubes 208. As the shaft 202 rotates, the impeller 216 operates and drawsthe cooled liquid into the impeller case 214. The cooled liquid is thentransported out of the impeller case 214 and into the conduit 118B bythe impeller 216.

It should be appreciated that in one embodiment of the presentinvention, the conduit 108B is positioned above the heat dissipater 210and above the output cavity 212. As such, as the heated liquid receivedin input cavity 200 flows through the heat dissipater 210, the heatedliquid is transformed into cooled liquid, which is heavier than theheated liquid. The heavier-cooled liquid then falls to the bottom of theheat dissipater 210 and is deposited in the output cavity 212. Theheavier-cooled liquid is output through the conduit 118B using theimpeller 216. In addition, in an alternate embodiment, when the impeller216 is not operating, the movement of the heavier-cooled liquidgenerates momentum (i.e., convective liquid circulation) in the liquidcooling system of FIG. 1 as the cooled liquid moves from the inputcavity 200, through the heat dissipater 210 to the output cavity 212.

In one embodiment, air flows over the fin 204 and through the fins 206to provide additional cooling of liquid flowing through the liquid tubes208. For example, using FIG. 1 in combination with FIG. 2, air isgenerated by fan 116 and flows through the fin units 204 and fins 206 toprovide additional cooling by cooling both the fin units 204 and theliquid flowing in the liquid tubes 208.

FIG. 3 displays a system view of an embodiment of a liquid coolingsystem disposed in a housing and implemented in accordance with theteachings of the present invention. A data processing and liquid coolingsystem is depicted. The data processing and liquid cooling systemcomprises a housing 300 (e.g., a computer cabinet or case) and aprocessor 302 (e.g., a processing unit, CPU, microprocessor) disposedwithin housing 305. The data processing and liquid cooling system 300further comprises a heat transfer system 304 engaged with one or moresurfaces of a processor 302, a transport system 307, and a heat exchangesystem 310. It should be appreciated that a variety of heat transfersystems 304 implemented in accordance with the teachings of the presentinvention may be used as heat transfer system 304.

A liquid coolant is circulated through heat transfer system 304 asindicated by flow indicators 301 and by transport system 307. Transportsystem 307 delivers cooled liquid from and returns heated liquid to heatexchange system 310.

More specifically, as the processor 302 functions, it generates heat. Inthe case of a typical processor 302, the heat generated can easily reachdestructive levels. This heat is typically generated at a rate of acertain amount of BTU per second. Heating usually starts at ambienttemperature and continues to rise until reaching a maximum. When themachine is turned off, the heat from processor 302 will peak to an evenhigher maximum. This temperature peak can be so high that a processor302 will fail. This failure may be permanent or temporary. With thepresent invention, this temperature peak is virtually eliminated.Operation at higher system speeds will amplify this effect even more.With the present invention, however, processor 302 is cooled to within afew degrees of room temperature. In addition, processor 302 will remainwithin a few degrees of room temperature after system shut down.

Depending upon specific design constraints and criteria, heat transfersystem 304 may be coupled to processor 302 in a number of ways. Asdepicted, heat transfer system 304 is engaged with the top surface ofprocessor 302. This contact may be established using, for example, athermal epoxy, a dielectric compound, or any other suitable contrivancethat provides direct and thorough transfer of heat from the surface ofprocessor 302 to the heat transfer system 304. A thermal epoxy may beused to facilitate the contact between processor 302 and heat transfersystem 304. Optionally, the epoxy may have metal casing disposed withinto provide better heat removal. Alternatively, a silicon dielectric maybe utilized. Alternatively, mechanical fasteners (e.g., clamps orbrackets) may be used, alone or in conjunction with epoxy or dielectric,to adjoin the units in direct contact. Other methods can be used or acombination of the methods can be used. Further, it should beappreciated that the heat transfer system 304 may be attached to anypart of the processor 302 and still remain within the scope of thepresent invention.

In an embodiment, liquid cooling system 300 represents an application ofthe present invention in larger data processing systems, such aspersonal computers or server equipment. Heat exchange system 310comprises a coolant reservoir 314 and a heat exchange system 330 coupledtogether by liquid conduit 328. Liquid cooling system 300 furthercomprises conduit 308, which couples coolant reservoir 314 to transfersystem 304. Liquid cooling system 300 further comprises conduit 306,which couples heat exchange system 310 to the heat transfer system 304.Conduit 308 transports cooled liquid 320 from coolant reservoir 314 tothe heat transfer system 304. Liquid conduit 306 receives and transfersheated liquid from the heat transfer system 304 to heat exchange system310. Conduit 328 transports cooled liquid from heat exchange system 330back to coolant reservoir 314. Conduits 306, 308, and 328 may comprise anumber of suitable rigid, semi-rigid, or flexible materials (e.g.,copper tubing, metallic flex tubing, or plastic tubing) depending upondesired cost and performance characteristics. Conduits 306, 308, and 328may be inter-coupled or joined with other system components using anyappropriate permanent or temporary contrivances (e.g., such assoldering, adhesives, or mechanical clamps).

Coolant reservoir 314 receives and stores cooled liquid 320 from conduit328. Cooled liquid 320 is a non-corrosive, low-toxicity liquid,resilient and resistant to chemical breakdown after repeated usage whileproviding efficient heat transfer and protection against corrosion.Depending upon particular cost and design criteria, a number of gasesand liquids may be utilized in accordance with the present invention(e.g., propylene glycol). Coolant reservoir 314 is a sealed structureappropriately adapted to house conduits 328 and 308. Coolant reservoir314 is also adapted to house a pump assembly 316. Pump assembly 316 maycomprise a pump motor 312 disposed upon an upper surface of coolantcavity 314 and an impeller assembly 324 which extends from the pumpmotor 312 to the bottom portion of coolant reservoir 314 and into cooledliquid 320 stored therein. The portion of delivery conduit 308 withincoolant reservoir 314 and pump assembly 316 are adapted to pump cooledliquid 320 from coolant reservoir 314 into and along conduit 308. In oneembodiment, pump assembly 316 includes a motor 312, a shaft 322 and animpeller 324. Conduit 308 may be directly coupled to pump assembly 316to satisfy this relationship or conduit 308 may be disposed proximal toimpeller assembly 324 such that the desired pumping is effected.

Heat exchange system 330 receives heated liquid via conduit 306. Heatexchange system 330 may be formed or assembled from a suitable thermalconductive material (e.g., brass or copper). Heat exchange system 330comprises one or more chambers, coupled through a liquid path (e.g.,heat dissipater 332 consisting of canals, tubes). Heated liquid isreceived from conduit 306 and transported through heat exchange system330 leaving heat exchange system 330 through conduit 328. The liquidflows through the chambers of heat exchange system 330 therebytransferring heat from the liquid to the walls of heat exchange system330 may further comprise one or more heat dissipaters 332 to enhanceheat transfer from the liquid as it flows through heat dissipater 332disposed in heat exchange system 330. Heat dissipater 332 comprises astructure appropriate to affect the desired heat transfer (e.g. rippledfins). In one embodiment, an attachment mechanism 334 connects heattransfer system (310 & 330) to casing 305 for further dissipation ofheat. A more thorough discussion of the liquid cooling system 300depicted in FIG. 3 may be derived from U.S. Pat. No. 6,529,376, entitled“System Processor Heat Dissipation,” issued on Mar. 4, 2003, which isherein incorporated by reference.

FIG. 4A displays a system view of a liquid cooling system suitable foruse in a mobile computing environment, such as a laptop, and implementedin accordance with the teachings of the present invention. The material,selection, and scale of the elements of liquid cooling system 400 areadjusted according to the particular cost size and performance criteriaof the particular application. A heat transfer system is shown as 420.The heat transfer system 420 is coupled to the heat exchange system 406by conduits 402 and 418.

Conduit 418 transports cooled liquid 414 from the heat exchange system406 to the heat transfer system 420. Conduit 402 receives and transfersheated liquid from the heat transfer system 420 and transfers the heatedliquid shown as 404 to the heat exchange system 406. In one embodiment,conduit 402 and conduit 418 may comprise a number suitable rigid,semi-rigid, or flexible materials. (e.g., copper tubing, metal flextubing, or plastic tubing) depending on desired costs and performancecharacteristics required. Conduit 402 and conduit 418 may beinter-coupled or joined with other system components using anyappropriate permanent or temporary connection mechanism, such assoldering, adhesives, mechanical clamps, or any combination thereof.

Heat transfer system 420 includes a cavity (not shown in FIG. 4A). Heattransfer system 420 receives cooled liquid from conduit 418. The cooledliquid is a non-corrosive, low-toxicity liquid, resilient and resistantto chemical breakdown after repeated usage while providing efficientheat transfer. Depending upon particular cost and design criteria, anumber of gases and liquids may be utilized in accordance with thepresent invention (e.g., propylene glycol).

During operation, the fan 416 blows air over the fins 412. The air keepsthe fins 412 cool which in turn cool the liquid in liquid flow tubes410. A pump (not shown in FIG. 4A) disposed in the heat transfer system420 drives liquid around in the system. Cooled liquid enters the heattransfer system 420 and heated liquid exits the heat transfer system420. A conduit 402 transfers the heated liquid shown as 404 to heatexchange system 406. The heated liquid flows through the liquid flowtubes 410 and is cooled by the fins 412 and the air flowing from the fan416. Cooled liquid 414 then exits the heat exchange system 406 and isconveyed on conduit 418 to the heat transfer system 420.

FIG. 48 displays a cross-sectional view of heat exchange system 406along sectional lines 408 of FIG. 4A. In FIG. 48, the liquid flow tubes410 are shown surrounded by the fins 412. It should be appreciated thatthe fins 412 may be deployed in a variety of different configurationsand still remain within the scope of the present invention.

FIG. 5 displays a system view of another liquid cooling system suitablefor use in a mobile computing system, such as a Personal Data Assistant(PDA), and implemented in accordance with the teachings of the presentinvention. Liquid cooling system 500 represents an application of thepresent invention in smaller handheld applications, such as palmtopcomputers, cell phones, or PDAs. The material selection and scale of theelements of liquid cooling system 500 are adjusted according to theparticular cost, size, and performance criteria of the particularapplication. Liquid cooling system 500 includes a heat transfer system502 and a heat exchange system 504. Cooled liquid is communicated fromthe heat exchange system 504 to the heat transfer system 502 through aconduit 520. Heated liquid is transferred from the heat transfer system502 to the heat exchange system 504 through the conduit 510.

The heat exchange system 504 includes liquid flow tubes 505 forconveying and cooling liquid. Fins 506 are interspersed between theliquid flow tubes 505. However, it should be appreciated that a varietyof configurations may be implemented and still remain within the scopeof the present invention. For example, the liquid flow tubes 505 maytake a variety of horizontal, vertical, and serpentine configurations.In addition, the fins 506 may be deployed as vertical fins, horizontalfins, etc. Lastly, the fins 506 and liquid flow tubes 505 may bedeployed relative to each other, in a manner that maximizes cooling ofliquid flowing through the liquid flow tubes 505.

In one embodiment, the fins 506 in combination with the liquid flowtubes 505 may be considered a heat dissipater. In another embodiment,the fins 506 may be considered a heat dissipater. Yet in anotherembodiment, the liquid flow tubes 505 positioned to receive air flowingover the liquid flow tubes 505 may be considered a heat dissipater.

A motor 512 is also positioned in the heat exchange system 504. Themotor 512 and the cavity 514 form a sealed cavity for seal that retainsliquid 518. The motor 512 is connected to an impeller 516, which isdeployed in the cavity 514. In one embodiment, the motor 512 incombination with the impeller 516 is considered a pump. In anotherembodiment, the impeller 516 is considered a pump. Conduit 510 bringscooled liquid into the cavity 514 and conduit 520 removes the cooled airfrom the cavity 514.

Conduits 510 and 520 may comprise a number of suitable rigid,semi-rigid, or flexible materials (e.g., copper tubing, metallic flextubing, or plastic tubing) depending upon desired cost and performancecharacteristics. Conduits 510 and 520 may be incorporated or joined withother system components using any appropriate permanent or temporarycontrivances (e.g., such as soldering, adhesives, mechanical clamps, orany combination thereof).

Cavity 514, which acts as a reservoir, receives and stores cooledliquid. Liquid 518 is a non-corrosive, low-toxicity liquid, resilientand resistant to chemical breakdown after repeated usage while providingefficient heat transfer and corrosion prevention. Depending uponparticular cost and design criteria, a number of gases and liquids maybe utilized in accordance with the present invention (e.g., propyleneglycol). Cavity 514 is a sealed structure appropriately adapted to houseconduits 510 and 520.

Depending upon a particular application, liquid cooling system 500 mayfurther comprise one or more airflow elements 508 disposed within liquidcooling system 500 to effect desired heat transfer. As depicted, airflowelements 508 may comprise fan blades coupled to motor 512, adapted toprovide air circulation as motor 512 operates. Alternatively, liquidcooling system 500 may comprise separate airflows assemblies disposedand adapted to provide or facilitate an airflow that enhances desiredheat transfer.

During operation, motor 512 operates and airflow elements 508 revolve.The revolving airflow elements 508 affect airflow through the heatexchange system 504 and cool the fins 506. In addition, the airflowcools the liquid 518 in the cavity 514. In one embodiment, the airflowelements 508 produce 514. The motor 512 also drives impeller 516, whichperforms an intake function, and transfers cooled liquid 518 throughconduit 520 to the heat transfer system 502. The cooled liquid 518 isheated in heat transfer system 502 and transferred to heat exchangesystem 504. As the heated liquid flows through liquid flow tubes 505,the heated liquid is cooled and becomes cooled liquid as a result of theairflow on the fins 506 and the airflow over the liquid flow tubes 505.

Although the heat transfer system 502 is positioned in a specificorientation in FIG. 5, in one embodiment of the present invention, theheat transfer system 502 is positioned so that cooled air comes into thebottom of heat transfer system 502 and heated air exits through the topof heat transfer system 502.

FIG. 6 displays a top view of an embodiment of a heat transfer system,such as a solid-state system implemented in accordance with theteachings of the present invention. A heat transfer system 600 is shown.In one embodiment, the heat transfer system 600 is implemented as anelectron conducting material. The electron conducting material may be amaterial, which transfers electrons when an electric current is applied.In one embodiment of the present invention, the electron conductingmaterial is implemented with semiconductor materials, metal material,etc. A first electron conducting material 602 and a second electronconducting material 604 are shown. The electron conducting materials 602and 604 may be implemented with a variety of semiconductor materials,such as silicon, germanium, etc. and still remain within the scope ofthe present invention. Further, the electron conducting materials 602and 604 may be implemented with a mixture of semiconductor materials ora combination of semiconductor materials and other materials and stillremain within the scope of the present invention. In another embodiment,the electron conducting materials 602 and 604 may be implemented ashighly doped semiconductor materials. In yet another embodiment of thepresent invention, the electron conducting materials 602 and 604 mayinclude two conducting materials, which are different.

In one embodiment, the first electron conducting material 602 and thesecond electron conducting material 604 have a different molecularcomposition and may represent different semiconductor materials. In analternative embodiment, the first electron conducting material 602 andthe second electron conducting material 604 may represent thesemiconductor material doped with different amounts of electrons.

The first electron conducting material 602 and the second electronconducting material 604 are connected at a junction 614. In addition,electrical current is applied to both the first electron conductingmaterial 602 and the second electron conducting material 604. In oneembodiment, the electrical current is applied at a first polaritycausing the migration of electrons in one direction.

In one embodiment, the first electron conducting material 602 and thesecond electron conducting material 604 are configured so that whencurrent is applied to the first electron conducting material 602 and thesecond electron conducting material 604, the first electron conductingmaterial 602 and the second electron conducting material 604 experiencethe peltier effect. In another embodiment, the electron conductingmaterials 602 and 604 may be implemented to form a thermoelectriccooler, a peltier cooler, a solid-state refrigerator, a solid-state heatpump, a micro cooler, etc., or function as a thermoelectric system.

In one embodiment, the electron conducting materials 602 and 604 aresubject to the peltier effect. As such, as current is applied to thefirst electron conducting material 602, electrons migrate across thefirst electron conducting material 602 as shown by directional arrows616. Therefore, a cool region 608 develops at the junction 614 and a hotregion 606 develops in the direction of the electrons migration 616. Ina similar manner, as current is applied to the second electronconducting material 604, electron migrates across the second electronconducting material 604 as shown by directional arrows 618. Therefore, acool region 612 develops at the junction 614 and a hot region 610develops in the direction of the electrons migration 618.

As the electrons migrate as shown by directional arrows 616 and 618, thehot regions 606 and 610 continue to develop. Conduit 624 is connected tothe hot region 606 of first electron conducting material 602. Cooledliquid enters through inlet 620 and is conveyed on conduit 624 as shownby directional arrow 630. Conduit 628 is connected to hot region 610 ofsecond electron conducting material 604. The cooled liquid 630 thenexits conduit 624 through outlet 622. Cooled liquid enters through inlet620 and is conveyed on conduit 628 as shown by directional arrows 632.The cooled liquid 632 then exits conduit 628 through outlet 622.

During operation, electrical current is applied to first electronconducting material 602 and to second electron conducting material 604.As such, electrons migrate away from the junction 614. The electronsmigrate in a direction shown by directional arrows 616 and 618. As theelectrons migrate away from junction 614, a cold region 608 develops infirst electron conducting material 602 and a cold region 612 develops insecond electron conducting material 604. In addition, in the directionthat the electrons migrate (i.e., 616), a hot region 606 develops infirst electron conducting material 602. In the direction that theelectrons migrate (i.e., 618), a hot region 610 develops in secondelectron conducting material 604.

Cooled liquid shown by directional arrows 630 and 632 enters conduits624 and 628 through inlet 620. As the cooled liquids 630 and 632 aretransported in conduits 624 and 628, the cooled liquids 630 and 632dissipate heat from the hot regions 606 and 610. For example, as cooledliquid 630 is conveyed in conduit 624, the heat generated in hot region606 is lowered and hot region 606 becomes cooler. In addition, thecooled liquid 630 becomes heated liquid and heated liquid is output fromthe outlet 622. As the cooled liquid 632 is conveyed in conduit 628, theheat generated in hot region 610 is lowered and hot region 610 becomescooler. In addition, the cooled liquid 632 becomes heated liquid andheated liquid is output from the outlet 622.

In one embodiment of the present invention, conduits 624 and 628 areformed within or formed from the electron conducting materials. In asecond embodiment, conduits 624 and 628 are bonded to the electronconducting materials. It should be appreciated that conduits 624 and 628may be implemented with any material that may be configured to transferheat from the electron conducting materials.

FIG. 7A displays a bottom view of an embodiment of a heat transfersystem 700. The first electron conducting material 702 and the secondelectron conducting material 704 are connected at a junction 714. Inaddition, electrical current is applied to both the first electronconducting material 702 and the second electron conducting material 704.In one embodiment, the electrical current is applied at a firstpolarity. Applying the electrical current in a second polarity which isopposite from the first polarity will cause the electron current flow infirst electron conducting material 702 and the electron flow in secondelectron conducting material 704 to change directions.

In one embodiment, the first electron conducting material 702 and thesecond electron conducting material 704 are configured so that whencurrent is applied to the first electron conducting material 702 and thesecond electron conducting material 704, the first electron conductingmaterial 702 and the second electron conducting material 704 experiencethe peltier effect. As such, as current is applied to the first electronconducting material 702, electrons migrate across the first electronconducting material 702 as shown by directional arrows 716. Therefore, acool region 708 develops at the junction 714 and a hot region 706develops in the direction of the electrons migration 716. In a similarmanner, as current is applied to the second electron conducting material704, electrons migrate across the second electron conducting material704 as shown by directional arrows 718. Therefore, a cool region 712develops at the junction 714 and a hot region 710 develops in thedirection of the electrons migration 718.

As the electrons migrate as shown by directional arrows 716 and 718, thehot regions 706 and 710 continue to develop. Conduit 724 is connected tothe hot region 706 of first electron conducting material 702. Cooledliquid enters through inlet 720 and is conveyed on conduit 724 as shownby directional arrow 730. The cooled liquid 730 then exits conduit 724through outlet 722. Conduit 728 is connected to hot region 710 of secondelectron conducting material 704. Cooled liquid enters through inlet 720and is conveyed on conduit 728 as shown by directional arrows 732. Thecooled liquid 732 then exits conduit 728 through outlet 722.

A processor is shown as 734. In one embodiment, the processor 734includes a semiconductor device including packaging material. In anotherembodiment, the processor 734 includes a semiconductor device withoutpackaging material. It should be appreciated that in one embodiment ofthe present invention, the cold region 708 gradually transitions intothe hot region 706 and the cold region 712 gradually transitions intothe hot region 710. However, in one embodiment of the present invention,the processor 734 is positioned at the junction 714 toward the coldregion 708 of the first electron conducting material 702 and toward thecold region 712 of the second electron conducting material 704. Theprocessor 734 generates heat.

It should be appreciated that in a second embodiment, a single electronconducting material, such as 702 or 704, may be used to engage aprocessor, such as 734. In one embodiment, the single electronconducting material 702 or 704 would contact the processor 734 on thecold region 708 or 712.

During operation, electrical current is applied to first electronconducting material 702 and to second electron conducting material 704.As such, electrons migrate away from the junction 714. The electronsmigrate in a direction shown by directional arrows 716 and 718. As theelectrons migrate away from junction 714, a cold region 708 develops infirst electron conducting material 702 and a cold region 712 develops insecond electron conducting material 704. In addition, in the directionthat the electrons migrate (i.e., 716), a hot region 706 develops infirst electron conducting material 702. In the direction that theelectrons migrate (i.e., 718), a hot region 710 develops in secondelectron conducting material 704.

Cooled liquid shown by directional arrows 730 and 732 enters conduits724 and 728 through inlet 720. As the cooled liquids 730 and 732 aretransported in conduits 724 and 728, the cooled liquids 730 and 732dissipate heat from the hot regions 706 and 710. For example, as cooledliquid 730 is conveyed in conduit 724, the heat generated in hot region706 is lowered and hot region 706 becomes cooler. In addition, thecooled liquid 730 becomes heated liquid and heated liquid is output fromthe outlet 722. As the cooled liquid 732 is conveyed in conduit 728, theheat generated in hot region 710 is lowered and hot region 710 becomescooler. In addition, the cooled liquid 732 becomes heated liquid andheated liquid is the output from the outlet 722.

The processor 734 generates heat. Since the processor 734 is positionedat the junction 714 within the cold region 708 of the first electronconducting material 702 and within the cold region 712 of the secondelectron conducting material 704 as the processor 734 generates theheat, the cold region 708 of the first electron conducting material 702and the cold region 712 of the second electron conducting material 704absorb the heat. As the cold region 708 of the first electron conductingmaterial 702 and the cold region 712 of the second electron conductingmaterial 704 absorb the heat from the processor 734, the heat isdissipated from the processor 734. In addition, as the cold region 708of the first electron conducting material 702 and the cold region 712 ofthe second electron conducting material 704 absorb the heat from theprocessor 734, the heat migrates toward the hot region 706 of the firstelectron conducting material 702 and toward the hot region 710 of thesecond electron conducting material 704 as depicted by electronsmigration flow arrows 716 and 718. In one embodiment of the presentinvention, it should be appreciated that the terms cold and hot arerelative to each other, where the cold region is colder than the hotregion and the hot region is hotter than the cold region.

As heat dissipates from the processor 734 into the cold regions 708 and712, the cold regions 708 and 712 absorb the heat and increase intemperature (i.e., become hotter). The heat migrates from the coldregions 708 and 712 to the hot regions 706 and 710, respectively. As theheat migrates to the hot regions 706 and 710, the hot regions 706 and710 become hotter.

The conduits 724 and 728 convey cooled liquid shown by directionalarrows 730 and 732. The liquid enters inlet 720 as cooled liquids 730and 732. As the cooled liquids 730 and 732 are conveyed in conduits 724and 728 past the hot regions 706 and 710, the cooled liquids 730 and 732are heated in the conduits 724 and 728. The cooled liquids 730 and 732dissipate the heat from the hot regions 706 and 710. As a result, thecooled liquids 730 and 732 become heated liquid. The heated liquid exitsconduits 724 and 728 through outlet 722. As a result, during operation,heat is first transferred from the processor 734 to the cold regions 708and 712. As a result, the processor 734 dissipates heat into the coldregions 708 and 712 and the processor 734 is cooled. The heat thenmigrates to the hot regions 706 and 710. The heat migrates from the hotregions 706 and 710 to the cooled liquids 730 and 732 flowing in theconduits 724 and 728. As a result, the cooled liquids 730 and 732, whichentered conduits 724 and 728 through inlet 720, are heated and exitconduits 724 and 728 through outlet 722 as heated liquid. Transferringthe heat from the hot regions 706 and 710 also has the effect of coolingthe hot regions 706 and 710 and dissipating heat in the hot regions 706and 710.

FIG. 7B displays one embodiment of a sectional view of an embodiment ofa heat transfer system. The sectional view of the heat transfer systemof FIG. 7A along sectional line 726 is shown as heat transfer system700. In heat transfer system 700, first electron conducting material 702and second electron conducting material 704 are shown. First electronconducting material 702 and second electron conducting material 704 arejoined at junction 714. Electrons migrate from junction 714 in thedirection shown by directional arrows 716 and 718. As a result, a coldregion 708 and a hot region 706 are created in the first electronconducting material 702. In addition, a cold region 712 and a hot region710 develop in the second electron conducting material 704.

The connection of the first electron conducting material 702 and thesecond electron conducting material 704 form a receptacle 736. Aprocessor 734 is mated with receptacle 736. In one embodiment, theprocessor 734 is mated with the receptacle 736 using a variety oftechniques. For example, an adhesive may be used to mate the processor734 with the receptacle 736, a coupling device, such as a hinge, socket,etc., may be used to mate the processor 734 with the receptacle 736.Further, a variety of connection and or coupling mechanisms may be usedto mate the processor 734 with the receptacle 736.

During operation, heat is absorbed from the processor 734 into the coldregion 708 of first electron conducting material 702 and the cold region712 of second electron conducting material 704. The heat migrates to thehot region 706 of first electron conducting material 702 and to the hotregion 710 of second electron conducting material 704. The heat is thentransferred to cooled liquid flowing in the conduits 724 and 728. Thecooled liquid becomes heated liquid and the heated liquid is conveyedaway from the hot regions 706 and 710 using conduits 724 and 728.

FIG. 8 displays another embodiment of a sectional view of an embodimentof a heat transfer system. The sectional view of the heat transfersystem 800 is shown. In heat transfer system 800, first electronconducting material 802 and second electron conducting material 804 areshown. First electron conducting material 802 and second electronconducting material 804 are joined at junction 814. Electrons migratefrom junction 814 in the direction shown by directional arrows 816 and818. As a result, a cold region 808 and a hot region 806 are created inthe first electron conducting material 802. In addition, a cold region812 and a hot region 810 develop at in the second electron conductingmaterial 804.

During operation, heat is absorbed from the processor 834 into the coldregion 808 of first electron conducting material 802 and the cold region812 of second electron conducting material 804. The heat migrates to thehot region 806 of first electron conducting material 802 and to the hotregion 810 of second electron conducting material 804. The heat is thentransferred to cooled liquid flowing in the conduits 824 and 828. Thecooled liquid becomes heated liquid and the heated liquid is conveyedaway from the hot regions 806 and 810 using conduits 824 and 828.

A processor 834 is mated with first electron conducting material 802 andthe second electron conducting material 804. In one embodiment, theprocessor 834 is mated with the first electron conducting material 802and the second electron conducting material 804 using a variety oftechniques. For example, an adhesive may be used to mate the processor834 with the first electron conducting material 802 and the secondelectron conducting material 804. A coupling device, such as a hinge,socket, etc., may be used to mate the processor 834 with the firstelectron conducting material 802 and the second electron conductingmaterial 804. Further, a variety of connection and/or couplingmechanisms may be used to mate the processor 834 with the first electronconducting material 802 and the second electron conducting material 804.

During operation, heat is absorbed from the processor 834 into the coldregion 808 of first electron conducting material 802 and the cold region812 of second electron conducting material 804. The heat migrates to thehot region 806 of first electron conducting material 802 and to the hotregion 810 of second electron conducting material 804. The heat is thentransferred to cooled liquid flowing in the conduits 824 and 828. Thecooled liquid becomes heated liquid and the heated liquid is conveyedaway from the hot regions 806 and 810 using conduits 824 and 828.

FIG. 9 displays another embodiment of a sectional view of an embodimentof a heat transfer system, such as a multi-layered, solid-sate heattransfer system. In heat transfer system 900, first electron conductingmaterial 902 and second electron conducting material 904 are shown.First electron conducting material 902 and second electron conductingmaterial 904 are joined at junction 910. Electrons migrate from junction910 in the direction shown by directional arrows 906 and 908. As aresult, a cold region 934 and a hot region 932 are created in the firstelectron conducting material 902. In addition, a cold region 936 and ahot region 938 develop in the second electron conducting material 904.

A processor 930 is mated with first electron conducting material 902 andthe second electron conducting material 904. In one embodiment, theprocessor 930 is mated with the first electron conducting material 902and the second electron conducting material 904 using a variety oftechniques. For example, an adhesive may be used to mate the processor930 with the first electron conducting material 902 and the secondelectron conducting material 904. A coupling device, such as a hinge,socket, etc., may be used to mate the processor 930 with the firstelectron conducting material 902 and the second electron conductingmaterial 904. Further, a variety of connection and/or couplingmechanisms may be used to mate the processor 930 with the first electronconducting material 902 and the second electron conducting material 904.

Third electron conducting material 916 and fourth electron conductingmaterial 918 are joined at junction 920. Electrons migrate from junction920 in the direction shown by directional arrows 926 and 928. As aresult, a cold region 942 and a hot region 940 are created in the thirdelectron conducting material 916. In addition, a cold region 944 and ahot region 946 develop at in the fourth electron conducting material918.

A processor 950 is mated with first electron conducting material 902,second electron conducting material 904, third electron conductingmaterial 916, and fourth electron conducting material 918. In oneembodiment, the processor 950 is mated with the first electronconducting material 902, second electron conducting material 904, thirdelectron conducting material 916, and fourth electron conductingmaterial 918 using a variety of techniques. For example, an adhesive maybe used to mate the processor 950 with the first electron conductingmaterial 902, the second electron conducting material 904, the thirdelectron conducting material 916, and the fourth electron conductingmaterial 918. A coupling device, such as a hinge, socket, etc., may beused to mate the processor 950 with the first electron conductingmaterial 902, the second electron conducting material 904, the thirdelectron conducting material 916, and the fourth electron conductingmaterial 918. Further, a variety of connection and/or couplingmechanisms may be used to mate the processor 950 with the first electronconducting material 902, the second electron conducting material 904,the third electron conducting material 916, and the fourth electronconducting material 918.

During operation, heat is generated by processors 930 and 950. The heatis absorbed from the processor 930 into the cold region 934 of firstelectron conducting material 902, into the cold region 936 of secondelectron conducting material 904, into the cold region 942 of thirdelectron conducting material 916, and into the cold region 944 of fourthelectron conducting material 918. The heat is absorbed from theprocessor 950 into the cold region 942 of third electron conductingmaterial 916 and into the cold region 944 of fourth electron conductingmaterial 918. The heat migrates to the hot region 932 of first electronconducting material 902, to the hot region 938 of second electronconducting material 904, to hot region 940 of third electron conductingmaterial 916, and to hot region 946 of fourth electron conductingmaterial 918. The heat is then transferred to cool liquid flowing in theconduits 912, 914, 922, and 924. The cooled liquid becomes heated liquidand the heated liquid is conveyed away from the hot regions 932, 938,940, and 946 using conduits 912,914,922, and 924.

Thus, the present invention has been described herein with reference toa particular embodiment for a particular application. Those havingordinary skill in the art and access to the present teachings willrecognize additional modifications, applications, and embodiments withinthe scope thereof.

It is, therefore, intended by the appended claims to cover any and allsuch applications, modifications, and embodiments within the scope ofthe present invention.

1. A cooling system for cooling heat generating components comprising: Nheat transfer units wherein one or more of the N heat transfer unitsincludes an electron conducting material having a cold region thermallycoupled to one or more heat generating components and a hot regionthermally connected to a coolant pathway; N, N−1 or N+1 layers of one ormore heat generating components interleaved with the N heat transferunits such that one or more heat generating components are thermallycoupled to one or more cold regions of the electron conductingmaterials; wherein heat is absorbed from the heat generating componentsinto the cold regions of electron conducting materials, transferred tothe hot regions of such electron conducting materials and transferred toa coolant circulating through the coolant pathway, the coolant becomingheated coolant; and wherein N is an integer greater than
 1. 2. Thecooling system as set forth in claim 1 further comprising: one or moreheat exchange units coupled to the coolant pathway, the heat exchangeunits generating cooled coolant for transfer to the coolant pathway inresponse to receiving the heated coolant.
 3. The cooling system as setforth in claim 1 wherein one or more heat generating components havemore than one surface thereof thermally coupled to the cold region ormore than electron conducting material thereby enabling multi-sidedcooling of such heat generating components.
 4. The cooling system as setforth in claim 1 wherein one or more electron conducting materials havelength and width dimensions larger than the depth dimension and whereinheat is transferred from the cold regions to the hot regions of suchelectron conducting materials along the length or width dimension. 5.The cooling system as set forth in claim 4 wherein the length and widthdimensions are disposed in a parallel manner to the heat generatingcomponents.
 6. The cooling system as set forth in claim 1 wherein thecoolant pathway is disposed such that heated coolant from the transferof heat from the hot region to the coolant is directed upward forenhancing convective flow of the coolant.
 7. The cooling system of claim1 wherein the cold region and the hot region are part of an electronconducting material coupled to a power source.
 8. The cooling system ofclaim 1 wherein the electron conducting material is embedded in thesubstrate of a semiconductor material.
 9. The cooling system of claim 1wherein the electron conducting material is a solid state,peltier-effect device.
 10. The cooling system as set forth in claim 1,wherein one or more of the heat transfer units comprise a first electronconducting material including a first hot region and a first coldregion, a second electron conducting material and including a second hotregion and a second cold region, and wherein the first hot region andthe second hot region form the hot region and the first cold region andthe second cold region form the cold region.
 11. The cooling system asset forth in claim 10, wherein the first electron conducting materialand the second electron conducting material are coupled at a junction.12. A liquid cooling system as set forth in claim 11, wherein the firstelectron conducting material and the second electron conducting materialform a junction for coupling to one or more heat generating components.13. The cooling system of claim 10 wherein the first cold region and thesecond cold region are disposed in close proximity to each other and arethermally coupled to one or more heat-generating components and whereinthe first hot region and the second hot region are thermally coupled tothe coolant pathway, the cold regions absorbing heat from theheat-generating components and transferring such heat to the hotregions.
 14. The cooling system of claim 10 wherein the first hot regionand the second hot region are disposed in close proximity to each otherand are thermally coupled to the coolant pathway and wherein the firstcold region and the second cold region are thermally coupled to one ormore heat-generating components, the cold regions absorbing heat fromthe heat generating components and transferring such heat to the hotregions.
 15. An electronic system having the cooling system as set forthin claim
 1. 16. A mobile electronic system having the liquid coolingsystem as set forth in claim
 1. 17. A portable electronic system havingthe liquid cooling system as set forth in claim
 1. 18. A system withoptical devices having the liquid cooling system as set forth inclaim
 1. 19. A method for cooling heat generating components in a systemhaving N heat transfer units wherein one or more of the N heat transferunits includes an electron conducting material having a cold regionthermally coupled to one or more heat generating components and a hotregion thermally connected to a coolant pathway, N, N−1 or N+1 layers ofone or more heat generating components interleaved with the N heattransfer units such that one or more heat generating components arethermally coupled to one or more cold regions of the electron conductingmaterials, and wherein N is an integer greater than 1; the methodcomprising the steps of: transferring heat from one or moreheat-generating components to the cold region of one or more heattransfer units; transferring heat from the cold region to the hot regionof the heat transfer units; and absorbing heat from the hot region intoa coolant circulating through the coolant pathway, thereby heating thecoolant.
 20. The method as set forth in claim 19 wherein one or more ofthe heat transfer units comprise a first electron conducting materialincluding a first hot region and a first cold region, a second electronconducting material including a second hot region and a second coldregion, and wherein the first hot region and the second hot region formthe hot region and the first cold region and the second cold region formthe cold region.